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Nanoscale SiC sintered Structures for Advanced Microsystems and Power Electronics Packaging

Title
Nanoscale SiC sintered Structures for Advanced Microsystems and Power Electronics Packaging
Authors
박성진
Date Issued
2007-04-23
Publisher
CICMT
URI
https://oasis.postech.ac.kr/handle/2014.oak/45172
Article Type
Conference
Citation
Proceedings of 2007 IMAPS/ACerS 3rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2007), 2007-04-23
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