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Creep-fatigue crack propagation behavior of Sn-3.0ag-0.5cu lead-free solder

Title
Creep-fatigue crack propagation behavior of Sn-3.0ag-0.5cu lead-free solder
Authors
박현철우태욱Masao SakaneKaoru Kobayashi
Date Issued
2009-11-15
Publisher
JSME
URI
https://oasis.postech.ac.kr/handle/2014.oak/43596
Article Type
Conference
Citation
Asian Pacific Conference for Materials and Mechanics 2009, 2009-11-15
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박현철PARK, HYUN CHUL
엔지니어링 대학원
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