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TWIP강 기반 3층 복층강판에서의 계면강화 효과

Title
TWIP강 기반 3층 복층강판에서의 계면강화 효과
Authors
LEE, SUNG HAK김정기박형근이학현설재복CHIN, KWANG GEUN김형섭
POSTECH Authors
LEE, SUNG HAK김형섭
Date Issued
2017-11-17
Publisher
대한금속재료학회
URI
https://oasis.postech.ac.kr/handle/2014.oak/41710
Article Type
Conference
Citation
제 31회 첨단구조재료 심포지엄, 2017-11-17
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이성학LEE, SUNG HAK
Dept of Materials Science & Enginrg
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