A new bulk-micromachining using deep RIE and wet etching for an accelerometer
SCOPUS
- Title
- A new bulk-micromachining using deep RIE and wet etching for an accelerometer
- Authors
- Lim, G; Back, S; Esashi, M.
- Date Issued
- 1998-09
- Publisher
- WILEY
- Abstract
- A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P ++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/34361
- DOI
- 10.1541/ieejsmas.118.420
- ISSN
- 1341-8939
- Article Type
- Article
- Citation
- The Transactions of The Institute of Electrical Engineers of Japan, vol. 118, no. 9, page. 420 - 424, 1998-09
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- There are no files associated with this item.
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