Design of Hierarchical Cellular Metals Using Accumulative Bundle Extrusion
SCIE
SCOPUS
- Title
- Design of Hierarchical Cellular Metals Using Accumulative Bundle Extrusion
- Authors
- Latypov, MI; Lee, DJ; Jeong, HG; Lee, JB; Kim, HS
- Date Issued
- 2013-09
- Publisher
- SPRINGER
- Abstract
- This letter introduces a method for designing hierarchical cellular metals employing multipass accumulative bundle extrusion and selective dissolving. The method provides several degrees of freedom for manipulating both the cell-wall properties and architecture of cellular materials. Cellular copper was produced and analyzed as an example of implementing the proposed method. The material hierarchy that can be formed and controlled by means of multipass accumulative extrusion assures strength and enables the material to perform the prescribed functions. (C) The Minerals, Metals & Materials Society and ASM International 2013
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/11604
- DOI
- 10.1007/S11661-013-1844-2
- ISSN
- 1073-5623
- Article Type
- Article
- Citation
- METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, vol. 44A, no. 9, page. 4031 - 4036, 2013-09
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