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A transfer method for embedding conductive fillers on the surface of multi-scale structures for 3D flexible conductors
- Title
- A transfer method for embedding conductive fillers on the surface of multi-scale structures for 3D flexible conductors
- Date Issued
- 2023-01-16
- Publisher
- IEEE
- Article Type
- Conference
- Citation
- The 36th IEEE International Conference on MEMS 2023, 2023-01-16
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Related Researcher
- 김준원KIM, JOON WON
- Dept of Mechanical Enginrg