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Cited 19 time in webofscience Cited 17 time in scopus
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Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films

Title
Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
Authors
Park, JSKang, SWKim, H
POSTECH Authors
Kim, H
Date Issued
Jan-2006
Publisher
A V S AMER INST PHYSICS
URI
http://oasis.postech.ac.kr/handle/2014.oak/11286
DOI
10.1116/1.2198846
ISSN
1071-1023
Article Type
Article
Citation
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, no. 3, page. 1327 - 1332, 2006-01
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김형준KIM, HYUNGJUN
Dept of Materials Science & Enginrg
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