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Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
- Title
- Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
- POSTECH Authors
- Kim, H
- Date Issued
- Jan-2006
- Publisher
- A V S AMER INST PHYSICS
- ISSN
- 1071-1023
- Article Type
- Article
- Citation
- JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, no. 3, page. 1327 - 1332, 2006-01
- Files in This Item:
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Related Researcher
- 김형준KIM, HYUNGJUN
- Dept of Materials Science & Enginrg