DC Field | Value | Language |
---|---|---|
dc.contributor.author | Luisier, A | - |
dc.contributor.author | Utke, I | - |
dc.contributor.author | Bret, T | - |
dc.contributor.author | Cicoira, F | - |
dc.contributor.author | Hauert, R | - |
dc.contributor.author | Rhee, SW | - |
dc.contributor.author | Doppelt, P | - |
dc.contributor.author | Hoffmann, P | - |
dc.date.accessioned | 2015-06-25T02:31:37Z | - |
dc.date.available | 2015-06-25T02:31:37Z | - |
dc.date.created | 2009-03-16 | - |
dc.date.issued | 2004-01 | - |
dc.identifier.issn | 0013-4651 | - |
dc.identifier.other | 2015-OAK-0000010630 | en_US |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/11132 | - |
dc.description.abstract | The copper precursors bis-hexafluoroacetylacetonato-copper Cu(hfac)(2), vinyl-trimethyl-silane-copper(I)-hexafluoroacetylacetonate (hfac)Cu(VTMS), 2-methyl-1-hexen-3-yne-copper-hexafluoroacetylacetonate (hfac)Cu(MHY), and dimethyl-butene-copper(I)-hexafluoroacetylacetonate (hfac)Cu(DMB) are compared with respect to deposition rates and metal content obtained by focused electron beam induced deposition. Exposure was performed with 25 keV electrons in a Cambridge S100 scanning electron microscope equipped with a lithography system. Tip deposition rates increase with increasing precursor vapor pressure and range between 47 nm/s for (hfac) Cu(DMB) to about 4 nm/s for Cu(hfac)(2). A decay of deposition rates with time, i.e., tip length, is observed. Electric 4-point measurements indicate an insulating behavior of deposited lines for all precursors. In contrast, Cu contents of up to 45-60 atom % were found by Auger electron spectroscopy in thin rectangular deposits using (hfac)Cu(DMB) and (hfac)Cu(VTMS) as precursors. A discussion in terms of monolayer coverage, completeness of precursor molecule dissociation, and precursor stability is presented. (C) 2004 The Electrochemical Society. | - |
dc.description.statementofresponsibility | open | en_US |
dc.language | English | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.relation.isPartOf | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | - |
dc.rights | BY_NC_ND | en_US |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/2.0/kr | en_US |
dc.title | Comparative study of Cu precursors for 3D focused electron beam induced deposition | - |
dc.type | Article | - |
dc.contributor.college | 화학공학과 | en_US |
dc.identifier.doi | 10.1149/1.1765680 | - |
dc.author.google | Luisier, A | en_US |
dc.author.google | Utke, I | en_US |
dc.author.google | Hoffmann, P | en_US |
dc.author.google | Doppelt, P | en_US |
dc.author.google | Rhee, SW | en_US |
dc.author.google | Hauert, R | en_US |
dc.author.google | Cicoira, F | en_US |
dc.author.google | Bret, T | en_US |
dc.relation.volume | 151 | en_US |
dc.relation.issue | 8 | en_US |
dc.contributor.id | 10052631 | en_US |
dc.relation.journal | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | en_US |
dc.relation.index | SCI급, SCOPUS 등재논문 | en_US |
dc.collections.name | Journal Papers | en_US |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.8, pp.C535 - C537 | - |
dc.identifier.wosid | 000222969500038 | - |
dc.date.tcdate | 2019-01-01 | - |
dc.citation.endPage | C537 | - |
dc.citation.number | 8 | - |
dc.citation.startPage | C535 | - |
dc.citation.title | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | - |
dc.citation.volume | 151 | - |
dc.contributor.affiliatedAuthor | Rhee, SW | - |
dc.identifier.scopusid | 2-s2.0-4344702148 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 21 | - |
dc.description.scptc | 23 | * |
dc.date.scptcdate | 2018-10-274 | * |
dc.type.docType | Article | - |
dc.subject.keywordPlus | CHEMICAL-VAPOR-DEPOSITION | - |
dc.subject.keywordPlus | COPPER | - |
dc.subject.keywordPlus | MICROELECTRONICS | - |
dc.subject.keywordPlus | MICROSCOPY | - |
dc.subject.keywordPlus | TEMPERATURE | - |
dc.subject.keywordPlus | SUPERTIPS | - |
dc.subject.keywordPlus | WIRES | - |
dc.subject.keywordPlus | TIPS | - |
dc.relation.journalWebOfScienceCategory | Electrochemistry | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Electrochemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
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