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PARK, CHAN GYUNG (박찬경)

Dept of Materials Science & Engineering(신소재공학과)

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GROWTH:23||BEHAVIOR:17||FIELDEMISSION:11||MECHANICALPROPERTIES:10||FILMS:9||MORPHOLOGY:8||THINFILMS:8||ARRAYS:8||MECHANISM:8||CHEMICALVAPORDEPOSITION:8||ALLOYS:7||MICROSTRUCTURE:7||SI:6||SILICON:6||PARTICLES:6||AUSTENITE:6||GE:6||WEAR:5||microstructure:5||CAPSULES:5||DEFORMATION:5||DERIVATIVES:5||transmission electron microscopy:5||POWER:5||cucurbituril:5||TEMPERATURE:5||GAAS:5||NANOPARTICLES:4||SILICON NANOWIRES:4||carbon nanotubes:4||electrical properties:4||AQUEOUSSOLUTION:4||Atom probe tomography:4||OPTICALPROPERTIES:4||EVOLUTION:4||nanostructures:4||GLASS:4||DEPOSITION:4||SURFACE:4||WATER:4||transmission electron microscopy (TEM):4||SULFUR:4||atomic layer deposition:4||DECOMPOSITION:4||STABILITY:3||ALUMINUM:3||CRYSTALS:3||EMISSION:3||OXIDATION:3||TA:3||thermal barrier coatings:3||oxidation:3||CUCURBITURIL:3||HVOF:3||ABSORBER:3||PHOTOPOLYMERIZATIONS:3||STRAIN:3||PD:3||FABRICATION:3||Mechanical properties:3||atom probe:3||SPECTROSCOPY:3||SEGREGATION:3||diffusion:3||DUCTILITY:3||ROUTE:3||Transmission electron microscopy:3||TRANSFORMATION:3||SYSTEM:3||supramolecular chemistry:3||OXIDES:3||ABRASIVE WEAR BEHAVIOR:3||PHOTOLUMINESCENCE:3||ELECTRICALPROPERTIES:3||PHOTOINITIATORS:3||TEM:3||SHEET:3||permalloy:3||Microstructure:3||WCCo:3||hostguest systems:3||TEMPLATES:3||ohmic contact:3||LASERABLATION:2||PHYSICS:2||PLASMON RESONANCE:2||EFFICIENCY:2||Xray photoelectron spectra:2||MICROCAPSULES:2||TOUGHNESS:2||MNCD:2||304STAINLESSSTEEL:2||SUPERCAPACITOR:2||DEVICE:2||heterogeneous catalysis:2||GOLD NANOPARTICLES:2||SIO2:2||DECARBURIZATION:2||InGaN:2||magnetic property:2||Rapid solidification:2||cooling rate:2||FERRITE:2||ANODIC ALUMINA:2||CAPACITORS:2||RESISTIVITY:2||cementite dissolution:2||mechanical properties:2||METATHESIS:2||NANOCRYSTALS:2||FILM:2||HOST:2||POLYMERIZATION:2||leakage currents:2||NEXAFS:2||ALUMINUMLITHIUM ALLOYS:2||CRACKPROPAGATION:2||CU ALLOY:2||PHOTOINDUCED HYDROPHILICITY:2||ELECTROCHEMICAL CAPACITORS:2||DLIMOCVD:2||MFS:2||FIELDEFFECT TRANSISTOR:2||DENDRIMERS:2||SELFASSEMBLED MONOLAYERS:2||CHROMIUM:2||INDIUM:2||IRON:2||hybrid coating system:2||THERMALSTABILITY:2||ZnO:2||nanorods:2||RuCp2:2||ELECTRODE:2||CAPACITOR:2||highlowdoped GaAs:2||SI NANOWIRES:2||BOTTOM ELECTRODES:2||Ti3AlNb alloy:2||aluminum alloys:2||IRONALUMINUM ALLOYS:2||NANORODS:2||template synthesis:2||CONCANAVALINA:2||conduction bands:2||FATIGUE:2||Selfcleaning effect:2||Titanium dioxide:2||Amorphous structure:2||phase boundary sliding:2||crack closure load measurement:2||RIBBONS:2||dielectric materials:2||hafnium compounds:2||CLOSURE:2||SURFACES:2||POLYMER:2||Microwave irradiation:2||SUZUKI REACTIONS:2||DRUGDELIVERY:2||HIGHVELOCITY OXYFUEL:2||STRIP:2||interfacial reaction:2||coiling process:2||carbonitride:2||CATALYSTS:2||hot corrosion:2||COMPLEX PERMEABILITY:2||detonation gun spray technique:2||SRTIO3:2||metalorganic vapor phase epitaxy (MOVPE):2||noncatalytic growth:2||NANOWIRES:2||oxygen exposure:2||sputtering:2||PEARLITIC STEEL:2||crack growth rates:2||NANOFIBRES:2||ISLANDS:2||Plasmaenhanced atomic layer deposition:2||SEMICONDUCTOR PHOTOCATALYSIS:2||NANOFABRICATION:2||ALD:2||Si nanowire:2||BLT:2||ENE CLICK CHEMISTRY:2||BOND FORMATION:2||SIZE:2||WCCO COATINGS:2||OXIDE NANOWIRE ARRAYS:2||decomposition:2||precipitate:2||isothermal holding:2||thermal barrier coating:2||RECRYSTALLIZATION:2||CARBON NANOTUBE:2||Pd:2||polymers:2||PERCENT ALALLOY:2||SN EUTECTIC ALLOY:2||thermal spraying:2||transistors:2||FIELDEFFECT TRANSISTORS:2||crystal sturcture:2||nanoparticles:2||CEMENTED CARBIDES:2||ATOMPROBE:2||TEMPLATE:2||RU:2||fatigue resistance:2||LIQUIDSOLID MECHANISM:2||COPOLYMERS:2||Zn0.3wt.%Al alloy:2||SUPRAMOLECULAR CHEMISTRY:2||RESISTANCE:2||RETAINED AUSTENITE:2||LOWTEMPERATURE GROWTH:2||DESIGN:2||thermal stability:2||ALLOY:2||metalsemiconductor heterostructure:2||KINETICS:2||STORAGE:2||Ru:2||NICKEL NANOCRYSTALS:2||HOLLOW NANOSPHERES:2||PHASES:2||METAL:2||SINGLE:2||plasma materials processing:2||LITHIUM:2||polymer nanocapsules:2||support material:2||PALLADIUM NANOPARTICLES:2||PERFORMANCE:2||Electroless plating:2||CORROSION:2||Granular bainite:2||Threedimensional atom probe:2||BAINITE:2||melt drag:2||retained austenite:2||solidification:2||nanocomposite:2||NITRIDE:2||LAYER:2||steels:2||THERMODYNAMIC STABILITY:2||superplastic deformation:2||FeCrB alloy:2||accommodation mechanism:2||FRACTURE:2||acoustic emission technique:2||TIP:2||DIFFUSION:2||anodization:2||carbon composites:2||BILAYER VESICLES:2||OLIGOSACCHARIDES:2||interface states:2||Photocatalyst:2||PD NANOPARTICLES:2||COUPLING REACTIONS:2||COATINGS:2||CERMET COATINGS:2||NANOCOMPOSITE:2||crystal growth:2||atomprobe fieldion microscopy (APFIM):2||ALUMINUMALLOYS:2||Xray diffraction:2||TiAlSiN:2||PHASE:2||OXIDE THINFILMS:2||penetration depth:2||CATALYST:2||superplasticity:2||grain boundary sliding:2||Preferential evaporation:1||FIELD EVAPORATION BEHAVIOR:1||Friction:1||shallow trench isolation:1||Nanobeam secondary ion mass spectroscopy:1||ELECTRONMICROSCOPY:1||GRAINBOUNDARY:1||Electron backscatter diffraction:1||HSLA STEELS:1||MN:1||wellwidth fluctuation:1||SPINODAL DECOMPOSITION:1||TRIP effect:1||SITU NEUTRONDIFFRACTION:1||MARTENSITE EMBRITTLEMENT:1||RELIABILITY:1||preferred orientation:1||microscopic mechanism:1||agglomeration:1||BARRIER:1||NONSTOICHIOMETRY:1||NIOBIUM:1||LIQUID:1||SILICONNITRIDE:1||precipitation:1||METALLICGLASS:1||CONSTITUTION:1||diffusion barrier:1||optical metallography:1||spallation:1||DEGRADATION:1||surface modification:1||indium tin oxide (ITO):1||OXIDEFILMS:1||quantum dots:1||strontium ruthenium oxide:1||NiFeSi alloy:1||wear behavior:1||NIFE:1||thermal stability of quantum dot:1||quantum dot structure:1||Electron energy loss spectroscopy:1||wear resistant coating:1||ceria stabilized zirconia:1||Molecular beam epitaxy:1||Microstructure characterization:1||DYNAMIC COMBINATORIAL LIBRARIES:1||OLEFIN METATHESIS:1||NANONEEDLE ARRAYS:1||GROWTHMECHANISM:1||Aluminum oxide:1||WCCo coating:1||WC12CO COATINGS:1||STACKINGFAULT ENERGY:1||FCC>:1||HCP TRANSFORMATION:1||EPSILONMARTENSITE:1||yield:1||SiON:1||Multi quantum well:1||MOCVD:1||LED:1||IMPACT:1||LOWCARBON:1||PROBE TOMOGRAPHY:1||ALLOYSTEEL:1||COPPER:1||AL:1||IMPROVE:1||ion beam sputtering:1||annealing:1||conductivity:1||OXIDE:1||DROPLETS:1||drawing strain:1||laser assisted 3D AP:1||in situ TEM heating:1||detonation gun spray:1||zirconium oxide:1||molecular beam epitaxy:1||ELASTIC MISMATCH:1||SOLIDSTATE AMORPHIZATION:1||dislocation generation:1||OHMIC CONTACTS:1||meltquenched:1||semiconducting IIIV materials:1||INGAAS:1||Boron treated steel:1||AUTOBODY:1||Strain reducing layer:1||LASERS:1||CASTER:1||Multilayer InAs/GaAs:1||RADICAL POLYMERIZATION:1||microtexture:1||Throughsilicon via:1||H2O:1||GATE:1||NANOCRYSTALLINE WC:1||GRAINGROWTH:1||ZNAL2O4 NANOSTRUCTURES:1||ZNO NANOWALLS:1||NI:1||NANOSTRUCTURED COATINGS:1||CARBIDE GRAINSIZE:1||HARDNESS:1||Electron back scattered diffraction:1||atom probe tomography:1||Electroluminescence:1||INGAN:1||STEM:1||Ordered carbide:1||STEELS:1||INDUCED PLASTICITY STEEL:1||ZnO:Al:1||filtering medium:1||amorphous alloyepoxy composite:1||complex permeability and permittivity:1||functionally gradient material:1||kinetics:1||N):1||hypereutectoid steel wire:1||MOLYBDENUM NITRIDE:1||BIAS VOLTAGE:1||ARCPVD:1||CR FERRITIC STEELS:1||recovery:1||LIFE:1||dielectric constant:1||amorphization:1||FeCrB microstructure:1||low temperature growth:1||VANADIUM:1||antiphase boundary:1||AIP:1||melt drags:1||atomic layer epitaxy:1||TEMPERATUREDEPENDENCE:1||functionally gradient materials:1||Tungsten carbide:1||failure mechanism:1||Detonationgun:1||ATOMPROBE ANALYSIS:1||SHEETS:1||STRANSKIKRASTANOW GROWTH:1||low carbon steels:1||bainitic ferrite:1||3DAP:1||FUNCTIONALIZATION:1||CARBON NANOTUBES:1||DEVICES:1||LAYERS:1||Step coverage:1||Interface reaction:1||COMPOSITES:1||Nanowall:1||Nickel:1||HEATTREATMENT:1||Wear behavior:1||local magnification effect:1||TOMOGRAPHY:1||Lightweight steels:1||(FE,MN)(3)ALC:1||MULTIPHASE STEELS:1||segregation:1||METALS:1||NiFe alloy:1||secondary ion mass spectroscopy (SIMS):1||AUSTENITIC STAINLESSSTEEL:1||metallic glass:1||impedance matching:1||Cosilicide:1||CoSi2:1||EPITAXIAL COSI2:1||precipitates:1||GLASSES:1||SrRuO3:1||RUTHENIUM DIOXIDE:1||SPUTTERING TECHNIQUES:1||Mo:1||scanning electron microscopy:1||xray diffraction:1||MODEL:1||structure and morphology:1||heating temperature:1||As precipitate:1||Si effects:1||OXYGEN:1||RADIATIONDAMAGE:1||PEARLITE:1||CERAMIC COATINGS:1||High strain rate:1||NH3:1||SILICIDES:1||SEPARATION:1||STATES:1||3 dimensional atom probe tomography:1||Cementite dissolution:1||ferritic stainless steel:1||dislocation structures:1||Pd/Ge/Ti/Au:1||SELFORGANIZATION:1||NANORINGS:1||ENERGYTRANSFER:1||SOLARCELLS:1||BINARY REACTION SEQUENCE:1||SCALE:1||Grain growth:1||Kinetics parameters:1||WEAR BEHAVIOR:1||MICROSTRUCTURES:1||Carbon in highMn steel:1||epsilonmartensite:1||Line pipe HSLA steel:1||Interwoven bainite:1||TRIP STEELS:1||PRECIPITATION:1||Metalorganic chemical vapor deposition:1||Highcarbon steels:1||FECMN:1||INDUCED MARTENSITIC NUCLEATION:1||CARBON:1||INTERFACE:1||phase transformation:1||crystal structure:1||HEAT:1||melt quench:1||EPITAXIALGROWTH:1||grain boundary segregation:1||transparent conductive oxides:1||Stainless steels:1||superhardness:1||Co0.92Ta0.08/Si:1||BATIO3:1||residual stress:1||carbon content:1||MoSiN:1||nanocrystalline alpha(Fe,Cr) phase:1||metastable phase:1||toughness:1||electrical and optical properties:1||gallium arsenide:1||MOLECULARBEAM EPITAXY:1||NIOBIUM MICROALLOYED STEELS:1||orthorhombic domain:1||DISLOCATIONS:1||post heat treatment:1||TRANSPORTPROPERTIES:1||TI:1||InAs/GaAs quantum dot:1||tensile strength:1||POLARIZATION:1||BAND:1||WC/Co:1||Scanning electron microscopy (SEM):1||DEFORMATION TEXTURE:1||DISLOCATION DENSITY:1||TEMPERATURES:1||InAs quantum dot:1||FERROELECTRIC PROPERTIES:1||CEMENTITE DISSOLUTION:1||TIRE CORDS:1||MACROCYCLIC DISULFIDES:1||ultrasound:1||HIGHTEMPERATURE:1||Fe3Al:1||3DIMENSIONAL INTEGRATEDCIRCUITS:1||THINFILM:1||Shallow trench isolation:1||High temperature oxidation:1||mass spectrum:1||MULTIQUANTUM WELLS:1||HIGHSTRENGTH STEELS:1||XRAYDIFFRACTION:1||grain boundary:1||Yttriastabilized zirconia:1||doping:1||TEXTURE:1||magnetic properties:1||superhard:1||mechanical evaluation:1||magnetic relaxation:1||wave absorption:1||POLYCRYSTALLINE SILICON:1||BILAYER:1||MECHANISMS:1||PLANAR DEFECTS:1||carbides:1||TRIBOLOGICAL PROPERTIES:1||NITRIDE THINFILMS:1||SUPERHARD COATINGS:1||BA0.5SR0.5TIO3 THINFILMS:1||aluminum oxide:1||alloy:1||INTERMETALLIC COMPOUNDS:1||nano structured coating:1||permalloys:1||Si addition:1||GROWTH MODE TRANSITION:1||continuous phase transformation:1||steel tire cords:1||high carbon pearlitic steels:1||yttria stabilized zirconia:1||Strain rate hardening:1||Dislocation structure:1||NICKELOXIDE:1||Quantum dots:1||acicular ferrite:1||Drawing strain:1||NANOSPHERES:1||polymerization:1||COMPLEXATION:1||zinc oxide:1||GRAINSIZE:1||load relaxation test:1||NGAAS:1||GaAs MESFET:1||RINGS:1||NANOCAPSULES:1||Breakdown field:1||Highk dielectrics:1||SURFACECHEMISTRY:1||Atom probe:1||Sintering:1||Carbides:1||DENSIFICATION:1||NANOWIRE ARRAYS:1||CR CEMENTED CARBIDES:1||HARD METAL:1||transition layer:1||ACICULAR FERRITE:1||FIB:1||ZINCOXIDE:1||SIMS:1||MOLECULARBEAM:1||Decomposition:1||Austempering:1||Retained austenite:1||FERRITE GROWTH:1||thin films:1||W nanoparticle:1||AZO:1||PULSEDLASER DEPOSITION:1||NiP plating:1||amorphous Si3N4:1||ION PLATING METHOD:1||CoTa alloy:1||reheating:1||silicon:1||surface defect:1||rutheuim:1||coatings:1||GLASSFORMATION:1||martensite:1||TIN OXIDE:1||gallium:1||SYSTEMS:1||TiCrSiN:1||microhardness:1||1.3 MUM:1||ENERGYLEVELS:1||Surfaces and interfaces:1||CATHODE:1||INFRARED PHOTODETECTOR:1||ATOMICFORCE MICROSCOPE:1||Delamination:1||Carbon content:1||grain colony:1||ridging:1||diameter control:1||FACILE:1||Atomic layer deposition:1||CAPACITANCE:1||Microstructurefinal:1||CONSOLIDATION:1||ALLOYING ELEMENTS:1||DAMPING CAPACITY:1||BORON:1||Lath bainite:1||optoelectronic materials:1||ZINC:1||Composition fluctuation:1||DEPENDENCE:1||composition fluctuation of In:1||Bainite:1||tempering:1||GRAINBOUNDARIES:1||PHOSPHORUS:1||neutralizer:1||metals:1||TRIPaided steels:1||corrosion resistance:1||percolation phenomenon:1||amorphous alloyferriteepoxy composite:1||absorber:1||THICKNESS:1||PLASMA SPRAY:1||TRIP steels:1||coating defects:1||thermal fatigue:1||PHASESEPARATION:1||postprocessing annealing:1||PLASMA:1||STRENGTH:1||HSLA steels:1||solgel:1||lowtemperature growth:1||ORDERDISORDER TRANSFORMATION:1||misfit dislocation:1||Ni3Fe ordered phase:1||melt drag casting:1||PERMEABILITY:1||CCT diagram:1||ordered phase:1||Metallography:1||CARBONATE FUELCELLS:1||Electron backscattered diffraction:1||TENSILE TEST:1||WIDERANGE:1||STRESS:1||MUM:1||TRANSITION:1||Transmission electron microscopy (TEM):1||FATIGUE RESISTANCE:1||EBSD:1||nanorod:1||FLOW:1||anomalous yield behavior:1||WALLED CARBON NANOTUBES:1||

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