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PARK, CHAN GYUNG(박찬경)

Department: Dept of Materials Science & Enginrg(신소재공학과)

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GROWTH:15||BEHAVIOR:13||MECHANICALPROPERTIES:10||THINFILMS:8||MICROSTRUCTURE:7||MORPHOLOGY:7||SI:6||FIELDEMISSION:6||ALLOYS:6||FILMS:6||AUSTENITE:6||SILICON:6||WEAR:5||CHEMICALVAPORDEPOSITION:5||transmission electron microscopy:5||GAAS:5||DEFORMATION:5||MECHANISM:5||GE:4||microstructure:4||Atom probe tomography:4||OPTICALPROPERTIES:4||TEMPERATURE:4||ARRAYS:4||PARTICLES:4||SURFACE:4||transmission electron microscopy (TEM):4||EVOLUTION:4||STABILITY:3||DERIVATIVES:3||thermal barrier coatings:3||NANOPARTICLES:3||HVOF:3||ABSORBER:3||Mechanical properties:3||atom probe:3||SEGREGATION:3||diffusion:3||nanostructures:3||CAPSULES:3||Transmission electron microscopy:3||TRANSFORMATION:3||SYSTEM:3||ABRASIVE WEAR BEHAVIOR:3||DEPOSITION:3||PHOTOLUMINESCENCE:3||ELECTRICALPROPERTIES:3||TEM:3||SHEET:3||permalloy:3||POWER:3||WCCo:3||Microstructure:3||cucurbituril:3||OXIDATION:3||WCCO COATINGS:2||OXIDE NANOWIRE ARRAYS:2||decomposition:2||precipitate:2||isothermal holding:2||thermal barrier coating:2||RECRYSTALLIZATION:2||OXIDES:2||thermal spraying:2||GLASS:2||supramolecular chemistry:2||CEMENTED CARBIDES:2||ATOMPROBE:2||fatigue resistance:2||EFFICIENCY:2||PHOTOINITIATORS:2||SIO2:2||DECARBURIZATION:2||InGaN:2||Rapid solidification:2||magnetic property:2||cooling rate:2||FERRITE:2||CAPACITORS:2||cementite dissolution:2||mechanical properties:2||DENDRIMERS:2||WATER:2||CHROMIUM:2||INDIUM:2||IRON:2||hybrid coating system:2||THERMALSTABILITY:2||BOTTOM ELECTRODES:2||ALUMINUM:2||TEMPLATES:2||hostguest systems:2||SILICON NANOWIRES:2||atomic layer deposition:2||SULFUR:2||RESISTANCE:2||RETAINED AUSTENITE:2||DESIGN:2||KINETICS:2||thermal stability:2||ALLOY:2||METAL:2||CRYSTALS:2||ohmic contact:2||PERFORMANCE:2||Electroless plating:2||CORROSION:2||Granular bainite:2||Threedimensional atom probe:2||EMISSION:2||BAINITE:2||TA:2||retained austenite:2||melt drag:2||solidification:2||nanocomposite:2||NITRIDE:2||LAYER:2||steels:2||THERMODYNAMIC STABILITY:2||FeCrB alloy:2||oxidation:2||CUCURBITURIL:2||DECOMPOSITION:2||COATINGS:2||CERMET COATINGS:2||NANOCOMPOSITE:2||crystal growth:2||atomprobe fieldion microscopy (APFIM):2||Xray diffraction:2||ALUMINUMALLOYS:2||TiAlSiN:2||PHASE:2||RIBBONS:2||STRAIN:2||POLYMER:2||PHOTOPOLYMERIZATIONS:2||carbon nanotubes:2||electrical properties:2||PD:2||HIGHVELOCITY OXYFUEL:2||SPECTROSCOPY:2||FABRICATION:2||DUCTILITY:2||STRIP:2||coiling process:2||carbonitride:2||interfacial reaction:2||hot corrosion:2||COMPLEX PERMEABILITY:2||detonation gun spray technique:2||SRTIO3:2||sputtering:2||PEARLITIC STEEL:2||ISLANDS:2||ENE CLICK CHEMISTRY:2||ROUTE:2||AQUEOUSSOLUTION:2||SIZE:2||Preferential evaporation:1||FIELD EVAPORATION BEHAVIOR:1||Friction:1||shallow trench isolation:1||Nanobeam secondary ion mass spectroscopy:1||ELECTRONMICROSCOPY:1||GRAINBOUNDARY:1||Electron backscatter diffraction:1||HSLA STEELS:1||MN:1||wellwidth fluctuation:1||SPINODAL DECOMPOSITION:1||TRIP effect:1||SITU NEUTRONDIFFRACTION:1||RELIABILITY:1||MARTENSITE EMBRITTLEMENT:1||preferred orientation:1||microscopic mechanism:1||NONSTOICHIOMETRY:1||NIOBIUM:1||LIQUID:1||agglomeration:1||BARRIER:1||METALLICGLASS:1||precipitation:1||CONSTITUTION:1||diffusion barrier:1||optical metallography:1||spallation:1||DEGRADATION:1||surface modification:1||indium tin oxide (ITO):1||OXIDEFILMS:1||quantum dots:1||strontium ruthenium oxide:1||NiFeSi alloy:1||SILICONNITRIDE:1||wear behavior:1||NIFE:1||thermal stability of quantum dot:1||quantum dot structure:1||wear resistant coating:1||ceria stabilized zirconia:1||Electron energy loss spectroscopy:1||Molecular beam epitaxy:1||Microstructure characterization:1||DYNAMIC COMBINATORIAL LIBRARIES:1||OLEFIN METATHESIS:1||plasma materials processing:1||NICKEL NANOCRYSTALS:1||Ru:1||NANONEEDLE ARRAYS:1||GROWTHMECHANISM:1||HOLLOW NANOSPHERES:1||LOWTEMPERATURE GROWTH:1||STORAGE:1||SINGLE:1||metalsemiconductor heterostructure:1||LITHIUM:1||SUPRAMOLECULAR CHEMISTRY:1||PHASES:1||Aluminum oxide:1||WCCo coating:1||WC12CO COATINGS:1||STACKINGFAULT ENERGY:1||FCC>:1||HCP TRANSFORMATION:1||EPSILONMARTENSITE:1||Multi quantum well:1||MOCVD:1||LED:1||IMPACT:1||LOWCARBON:1||yield:1||SiON:1||PROBE TOMOGRAPHY:1||COPPER:1||AL:1||ALLOYSTEEL:1||annealing:1||IMPROVE:1||ion beam sputtering:1||conductivity:1||OXIDE:1||in situ TEM heating:1||detonation gun spray:1||zirconium oxide:1||DROPLETS:1||molecular beam epitaxy:1||SOLIDSTATE AMORPHIZATION:1||ELASTIC MISMATCH:1||dislocation generation:1||OHMIC CONTACTS:1||drawing strain:1||laser assisted 3D AP:1||meltquenched:1||semiconducting IIIV materials:1||INGAAS:1||Boron treated steel:1||AUTOBODY:1||Strain reducing layer:1||LASERS:1||CASTER:1||Multilayer InAs/GaAs:1||RADICAL POLYMERIZATION:1||Photocatalyst:1||interface states:1||anodization:1||BILAYER VESICLES:1||OLIGOSACCHARIDES:1||carbon composites:1||microtexture:1||superplastic deformation:1||accommodation mechanism:1||FRACTURE:1||acoustic emission technique:1||TIP:1||polymer nanocapsules:1||support material:1||PALLADIUM NANOPARTICLES:1||DIFFUSION:1||Throughsilicon via:1||H2O:1||GATE:1||NANOCRYSTALLINE WC:1||GRAINGROWTH:1||NI:1||NANOSTRUCTURED COATINGS:1||CARBIDE GRAINSIZE:1||HARDNESS:1||Electron back scattered diffraction:1||atom probe tomography:1||ZNAL2O4 NANOSTRUCTURES:1||ZNO NANOWALLS:1||Electroluminescence:1||INGAN:1||STEM:1||Ordered carbide:1||STEELS:1||INDUCED PLASTICITY STEEL:1||ZnO:Al:1||filtering medium:1||amorphous alloyepoxy composite:1||complex permeability and permittivity:1||functionally gradient material:1||kinetics:1||N):1||CR FERRITIC STEELS:1||recovery:1||LIFE:1||dielectric constant:1||amorphization:1||FeCrB microstructure:1||low temperature growth:1||VANADIUM:1||hypereutectoid steel wire:1||antiphase boundary:1||MOLYBDENUM NITRIDE:1||BIAS VOLTAGE:1||ARCPVD:1||AIP:1||melt drags:1||atomic layer epitaxy:1||TEMPERATUREDEPENDENCE:1||functionally gradient materials:1||Tungsten carbide:1||failure mechanism:1||Detonationgun:1||ATOMPROBE ANALYSIS:1||SHEETS:1||STRANSKIKRASTANOW GROWTH:1||bainitic ferrite:1||low carbon steels:1||3DAP:1||FUNCTIONALIZATION:1||SURFACES:1||Microwave irradiation:1||dielectric materials:1||hafnium compounds:1||CATALYST:1||OXIDE THINFILMS:1||CARBON NANOTUBES:1||penetration depth:1||superplasticity:1||grain boundary sliding:1||phase boundary sliding:1||crack closure load measurement:1||CLOSURE:1||PD NANOPARTICLES:1||COUPLING REACTIONS:1||DEVICES:1||LAYERS:1||Step coverage:1||Interface reaction:1||COMPOSITES:1||HEATTREATMENT:1||Wear behavior:1||local magnification effect:1||TOMOGRAPHY:1||Nanowall:1||Nickel:1||Lightweight steels:1||(FE,MN)(3)ALC:1||MULTIPHASE STEELS:1||METALS:1||segregation:1||secondary ion mass spectroscopy (SIMS):1||AUSTENITIC STAINLESSSTEEL:1||metallic glass:1||NiFe alloy:1||impedance matching:1||precipitates:1||GLASSES:1||Cosilicide:1||CoSi2:1||EPITAXIAL COSI2:1||SrRuO3:1||Mo:1||RUTHENIUM DIOXIDE:1||scanning electron microscopy:1||xray diffraction:1||MODEL:1||heating temperature:1||structure and morphology:1||As precipitate:1||Si effects:1||OXYGEN:1||SPUTTERING TECHNIQUES:1||RADIATIONDAMAGE:1||PEARLITE:1||CERAMIC COATINGS:1||High strain rate:1||NH3:1||SILICIDES:1||SEPARATION:1||STATES:1||3 dimensional atom probe tomography:1||Cementite dissolution:1||Plasmaenhanced atomic layer deposition:1||SEMICONDUCTOR PHOTOCATALYSIS:1||NANOFABRICATION:1||ALD:1||Si nanowire:1||oxygen exposure:1||CATALYSTS:1||NANOFIBRES:1||BLT:1||metalorganic vapor phase epitaxy (MOVPE):1||noncatalytic growth:1||NANOWIRES:1||ferritic stainless steel:1||dislocation structures:1||Pd/Ge/Ti/Au:1||crack growth rates:1||SELFORGANIZATION:1||NANORINGS:1||SUZUKI REACTIONS:1||DRUGDELIVERY:1||ENERGYTRANSFER:1||SOLARCELLS:1||BINARY REACTION SEQUENCE:1||SCALE:1||Grain growth:1||Kinetics parameters:1||WEAR BEHAVIOR:1||MICROSTRUCTURES:1||Carbon in highMn steel:1||epsilonmartensite:1||Line pipe HSLA steel:1||Interwoven bainite:1||TRIP STEELS:1||PRECIPITATION:1||Metalorganic chemical vapor deposition:1||Highcarbon steels:1||FECMN:1||INDUCED MARTENSITIC NUCLEATION:1||phase transformation:1||crystal structure:1||CARBON:1||INTERFACE:1||grain boundary segregation:1||transparent conductive oxides:1||Stainless steels:1||HEAT:1||melt quench:1||EPITAXIALGROWTH:1||superhardness:1||BATIO3:1||Co0.92Ta0.08/Si:1||nanocrystalline alpha(Fe,Cr) phase:1||metastable phase:1||toughness:1||electrical and optical properties:1||gallium arsenide:1||MOLECULARBEAM EPITAXY:1||NIOBIUM MICROALLOYED STEELS:1||residual stress:1||carbon content:1||orthorhombic domain:1||DISLOCATIONS:1||post heat treatment:1||MoSiN:1||TRANSPORTPROPERTIES:1||TI:1||InAs/GaAs quantum dot:1||POLARIZATION:1||tensile strength:1||BAND:1||WC/Co:1||Scanning electron microscopy (SEM):1||DEFORMATION TEXTURE:1||DISLOCATION DENSITY:1||TEMPERATURES:1||InAs quantum dot:1||FERROELECTRIC PROPERTIES:1||CEMENTITE DISSOLUTION:1||TIRE CORDS:1||MACROCYCLIC DISULFIDES:1||ultrasound:1||polymers:1||HIGHTEMPERATURE:1||Pd:1||transistors:1||FIELDEFFECT TRANSISTORS:1||crystal sturcture:1||CARBON NANOTUBE:1||SN EUTECTIC ALLOY:1||PERCENT ALALLOY:1||Fe3Al:1||BOND FORMATION:1||3DIMENSIONAL INTEGRATEDCIRCUITS:1||THINFILM:1||Shallow trench isolation:1||High temperature oxidation:1||MULTIQUANTUM WELLS:1||mass spectrum:1||HIGHSTRENGTH STEELS:1||XRAYDIFFRACTION:1||grain boundary:1||doping:1||TEXTURE:1||magnetic properties:1||Yttriastabilized zirconia:1||superhard:1||mechanical evaluation:1||wave absorption:1||magnetic relaxation:1||MECHANISMS:1||PLANAR DEFECTS:1||carbides:1||POLYCRYSTALLINE SILICON:1||BILAYER:1||BA0.5SR0.5TIO3 THINFILMS:1||aluminum oxide:1||alloy:1||INTERMETALLIC COMPOUNDS:1||nano structured coating:1||permalloys:1||Si addition:1||NITRIDE THINFILMS:1||TRIBOLOGICAL PROPERTIES:1||SUPERHARD COATINGS:1||GROWTH MODE TRANSITION:1||continuous phase transformation:1||steel tire cords:1||high carbon pearlitic steels:1||yttria stabilized zirconia:1||Strain rate hardening:1||Dislocation structure:1||NICKELOXIDE:1||Quantum dots:1||acicular ferrite:1||Drawing strain:1||NANOSPHERES:1||304STAINLESSSTEEL:1||polymerization:1||COMPLEXATION:1||Xray photoelectron spectra:1||LIQUIDSOLID MECHANISM:1||RU:1||zinc oxide:1||COPOLYMERS:1||TEMPLATE:1||GRAINSIZE:1||MICROCAPSULES:1||PLASMON RESONANCE:1||DEVICE:1||SUPERCAPACITOR:1||Zn0.3wt.%Al alloy:1||load relaxation test:1||GaAs MESFET:1||NGAAS:1||MNCD:1||TOUGHNESS:1||NANOCAPSULES:1||RINGS:1||nanoparticles:1||Breakdown field:1||Highk dielectrics:1||SURFACECHEMISTRY:1||Atom probe:1||Sintering:1||Carbides:1||DENSIFICATION:1||CR CEMENTED CARBIDES:1||HARD METAL:1||transition layer:1||ACICULAR FERRITE:1||FIB:1||ZINCOXIDE:1||NANOWIRE ARRAYS:1||MOLECULARBEAM:1||Decomposition:1||SIMS:1||Austempering:1||Retained austenite:1||FERRITE GROWTH:1||thin films:1||AZO:1||PULSEDLASER DEPOSITION:1||NiP plating:1||W nanoparticle:1||ION PLATING METHOD:1||amorphous Si3N4:1||reheating:1||CoTa alloy:1||silicon:1||coatings:1||GLASSFORMATION:1||martensite:1||rutheuim:1||TIN OXIDE:1||gallium:1||SYSTEMS:1||surface defect:1||TiCrSiN:1||microhardness:1||1.3 MUM:1||ENERGYLEVELS:1||Surfaces and interfaces:1||CATHODE:1||INFRARED PHOTODETECTOR:1||ATOMICFORCE MICROSCOPE:1||Delamination:1||Carbon content:1||PHOTOINDUCED HYDROPHILICITY:1||leakage currents:1||NEXAFS:1||NANOCRYSTALS:1||diameter control:1||METATHESIS:1||ANODIC ALUMINA:1||RESISTIVITY:1||FILM:1||HOST:1||POLYMERIZATION:1||DLIMOCVD:1||MFS:1||FIELDEFFECT TRANSISTOR:1||ELECTROCHEMICAL CAPACITORS:1||grain colony:1||ridging:1||ALUMINUMLITHIUM ALLOYS:1||CRACKPROPAGATION:1||CU ALLOY:1||FACILE:1||heterogeneous catalysis:1||GOLD NANOPARTICLES:1||Atomic layer deposition:1||CAPACITANCE:1||Microstructurefinal:1||CONSOLIDATION:1||ALLOYING ELEMENTS:1||DAMPING CAPACITY:1||BORON:1||Lath bainite:1||optoelectronic materials:1||ZINC:1||Composition fluctuation:1||DEPENDENCE:1||composition fluctuation of In:1||Bainite:1||tempering:1||GRAINBOUNDARIES:1||PHOSPHORUS:1||metals:1||TRIPaided steels:1||corrosion resistance:1||neutralizer:1||percolation phenomenon:1||amorphous alloyferriteepoxy composite:1||absorber:1||PLASMA SPRAY:1||TRIP steels:1||coating defects:1||thermal fatigue:1||PHASESEPARATION:1||THICKNESS:1||PLASMA:1||STRENGTH:1||HSLA steels:1||solgel:1||lowtemperature growth:1||ORDERDISORDER TRANSFORMATION:1||postprocessing annealing:1||misfit dislocation:1||melt drag casting:1||Ni3Fe ordered phase:1||PERMEABILITY:1||CCT diagram:1||ordered phase:1||Metallography:1||CARBONATE FUELCELLS:1||Electron backscattered diffraction:1||TENSILE TEST:1||WIDERANGE:1||STRESS:1||MUM:1||TRANSITION:1||Transmission electron microscopy (TEM):1||FATIGUE RESISTANCE:1||Titanium dioxide:1||Selfcleaning effect:1||Amorphous structure:1||LASERABLATION:1||conduction bands:1||SI NANOWIRES:1||RuCp2:1||ELECTRODE:1||CAPACITOR:1||NANORODS:1||nanorod:1||FLOW:1||IRONALUMINUM ALLOYS:1||highlowdoped GaAs:1||template synthesis:1||CONCANAVALINA:1||PHYSICS:1||ZnO:1||nanorods:1||EBSD:1||anomalous yield behavior:1||Ti3AlNb alloy:1||aluminum alloys:1||FATIGUE:1||WALLED CARBON NANOTUBES:1||SELFASSEMBLED MONOLAYERS:1||

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