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Impact of Thermo-Mechanical Stress Induced by Through-Silicon Vias on Performance Variations of 5-nm Node Si-Nanosheet FETs

Title
Impact of Thermo-Mechanical Stress Induced by Through-Silicon Vias on Performance Variations of 5-nm Node Si-Nanosheet FETs
Authors
Jeong, JinsuYoon, Jun-SikLee, SeunghwanBAEK, ROCK HYUN
Date Issued
4-Jul-2019
Publisher
NANO KOREA
URI
http://oasis.postech.ac.kr/handle/2014.oak/99378
Article Type
Conference
Citation
the 17th International Nanotech Symposium & Exhibition, 2019-07-04
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 BAEK, ROCK HYUN
Dept of Electrical Enginrg
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