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Impact of Line Mismatch on Two-Wire Deembedding Methods in Early Characterization of Emerging Interconnects

Title
Impact of Line Mismatch on Two-Wire Deembedding Methods in Early Characterization of Emerging Interconnects
Authors
최민수김태희임경현김병섭
Date Issued
May-2019
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Abstract
In this paper, we analyze the impact of line mismatch on two-wire deembedding methods in early characterization of emerging interconnects. According to our analysis, mismatch of wires significantly reduces the accuracy of deembedding methods using two test wire structures and causes unexpectedly large error. Therefore, characterizing emerging interconnects with the deembedding methods is not reliable in an early development period when the process variation is large. To help engineers to decide whether the deembedding methods are applicable or not, we theoretically and empirically analyze how line mismatch affects the deembedding accuracy, and derive a condition under which the deembedding methods are reliable.
URI
http://oasis.postech.ac.kr/handle/2014.oak/95857
ISSN
2156-3950
Article Type
Article
Citation
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 9, no. 5, page. 905 - 912, 2019-05
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 KIM, BYUNGSUB
Dept of Electrical Enginrg
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