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Full-speed USB 2.0 device용 Link및 Application Layer 칩

Title
Full-speed USB 2.0 device용 Link및 Application Layer 칩
Authors
김병섭신기범성기환심재윤박홍준
POSTECH Authors
김병섭
Date Issued
1-Nov-2013
Publisher
대한전자전기공학과
URI
http://oasis.postech.ac.kr/handle/2014.oak/68494
Article Type
Conference
Citation
대한전자공학회 추계종합학술대회, 2013-11-01
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