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Full-speed USB 2.0 device 용 Link 및 Application layer 칩

Title
Full-speed USB 2.0 device 용 Link 및 Application layer 칩
Authors
박홍준신기범성기환김병섭심재윤
POSTECH Authors
박홍준
Date Issued
23-Nov-2013
Publisher
대한전자공학회(IEIE)
URI
http://oasis.postech.ac.kr/handle/2014.oak/65266
Article Type
Conference
Citation
대한전자공학회(IEIE) 추계학술대회, 2013-11-23
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 PARK, HONG JUNE
Dept of Electrical Enginrg
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