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Development of HA-PLGA Scaffold Encapsulating Intact BMP-2 using Solid Freeform Fabrication Technology

Title
Development of HA-PLGA Scaffold Encapsulating Intact BMP-2 using Solid Freeform Fabrication Technology
Authors
조동우
POSTECH Authors
조동우
Date Issued
13-Jun-2011
Publisher
ASME
URI
http://oasis.postech.ac.kr/handle/2014.oak/58901
Article Type
Conference
Citation
2011 ASME International Manufacturing Science and Engineering Conference (MSEC), 2011-06-13
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조동우CHO, DONG WOO
Dept of Mechanical Enginrg
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