A Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded SoC
- A Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded SoC
- 이승구; 유승주; 김동기; J. Ahn; H. Jung
- POSTECH Authors
- 이승구; 유승주
- Date Issued
- European Design and Automation Association
- Article Type
- Design, Automation and Test in Europe, 2011-03-14
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