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A Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded SoC

Title
A Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded SoC
Authors
이승구유승주김동기J. AhnH. Jung
POSTECH Authors
이승구유승주
Date Issued
14-Mar-2011
Publisher
European Design and Automation Association
URI
http://oasis.postech.ac.kr/handle/2014.oak/57064
Article Type
Conference
Citation
Design, Automation and Test in Europe, 2011-03-14
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유승주YOO, SUNGJOO
Dept of Electrical Enginrg
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