Modeling of flow behavior of commercially pure Ti over a wide range of temperature and strain rate
- Title
- Modeling of flow behavior of commercially pure Ti over a wide range of temperature and strain rate
- Authors
- 이종수
- POSTECH Authors
- 이종수
- Date Issued
- 4-Nov-2010
- Publisher
- 대한금속재료학회
- URI
- http://oasis.postech.ac.kr/handle/2014.oak/56938
- Article Type
- Conference
- Citation
- 대한금속재료학회 추계학술대회, 2010-11-04
- Files in This Item:
- There are no files associated with this item.
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