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Effect of Cu doping on thermal stability improvement of silver metallization

Title
Effect of Cu doping on thermal stability improvement of silver metallization
Authors
이종람
POSTECH Authors
이종람
Date Issued
24-Mar-2008
Publisher
MRS
URI
http://oasis.postech.ac.kr/handle/2014.oak/43995
Article Type
Conference
Citation
Materials Research Society Spring meeting, 2008-03-24
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 LEE, JONG LAM
Dept of Materials Science & Enginrg
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