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Issue DateTitle
1996-Jan

IEICE TRANSACTIONS ON ELECTRONICS, vol. E79C, no. 12, page. 1726 - 1732, 1996-01

Lee, CH; Sim, JY; Park, HJ

2004-May

IEICE TRANSACTIONS ON ELECTRONICS, vol. E87C, no. 5, page. 801 - 808, 2004-05

Sim, JY; Kwon, KW; Chun, KC; Seo, DI

2004-Jun

IEICE TRANSACTIONS ON ELECTRONICS, vol. E87C, no. 6, page. 1037 - 1039, 2004-06

Sim, JY; Kwon, KW

2007-Jan

IEICE TRANSACTIONS ON ELECTRONICS, vol. E90C, no. 6, page. 1156 - 1164, 2007-01

Jang, YC; Bae, JH; Park, SH; Sim, JY; Park, HJ

2006-Dec

IEICE TRANSACTIONS ON ELECTRONICS, vol. E89C, no. 12, page. 1948 - 1949, 2006-12

Sim, JY

2005-Aug

IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 40, no. 8, page. 1688 - 1694, 2005-08

Sim, JY; Namgoong, W

2010-May

IEEE TRANSACTIONS ON ADVANCED PACKAGING, vol. 33, no. 2, page. 552 - 558, 2010-05

Kyoungho Lee; Hae-Kang Jung; Hyung-Joon Chi; Hye-Jung Kwon; Sim, JYPark, HJ

2010-Mar

PLASMA PROCESSES AND POLYMERS, vol. 7, no. 3-4, page. 281 - 287, 2010-03

Park, GY; Hong, YJ; Lee, HW; Sim, JY; Lee, JK

2010-May

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, vol. 57, no. 5, page. 379 - 383, 2010-05

Seo, YH; Kim, YS; Park, HJSim, JY

2011-Mar

IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 46, no. 3, page. 651 - 659, 2011-03

Lee, SK; Park, SJ; Park, HJSim, JY

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