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Issue DateTitle
2014-01

Lee, D; Park, J; Kim, J; Park, HJ; Lee, JS; Yoo, S; Park, JS; Kim, U; 유승주

2014-01

Lee, D; Park, J; Kim, J; Park, HJ; Lee, JS; Yoo, S; Park, JS; Kim, U; 박홍준

2015-05

Choi, M; Sim, JY; Park, HJ; Kim, B; 박홍준

1996-01

ELECTRONICS LETTERS, 32, 14, 1280, 1281

Lee, CH; Park, HJ

2010-01

Jung, HK; Lee, SM; Sim, JY; Park, HJ; 심재윤

2004-01

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 39, 11, 2087, 2092

Jeon, YJ; Lee, JH; Lee, HC; Jin, KW; Min, KS; Chung, JY; Park, HJ

2001-01

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 24, 4, 521, 527

Sohn, YS; Lee, JC; Park, HJ; Cho, SI

1997-01

IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 43, 2, 81, 91

Seo, SH; Park, HJ; Hong, KS; Kim, JH; Kim, YS; Park, KW

2000-01

ELECTRONICS LETTERS, 36, 6, 498, 500

Kim, JC; Jang, YC; Park, HJ

1999-01

ELECTRONICS LETTERS, 35, 11, 906, 907

Sohn, YS; Lee, JC; Park, HJ; Cho, SI

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