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Cited 6 time in webofscience Cited 9 time in scopus
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Sub-millimter and terahertz-wave packaging for large chip-width MMICs

Title
Sub-millimter and terahertz-wave packaging for large chip-width MMICs
Authors
Song, HJMatsuzaki, HYaita, M
Date Issued
Jan-2016
Publisher
Institute of Electrical and Electronics Engineers
URI
http://oasis.postech.ac.kr/handle/2014.oak/37308
ISSN
1531-1309
Article Type
Article
Citation
IEEE Microwave and Wireless Components Letters, vol. 26, no. 6, page. 422 - 424, 2016-01
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 SONG, HO JIN
Dept of Electrical Enginrg
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