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Sub-millimter and terahertz-wave packaging for large chip-width MMICs

Title
Sub-millimter and terahertz-wave packaging for large chip-width MMICs
Authors
Song, HJMatsuzaki, HYaita, M
Date Issued
Jan-2016
Publisher
Institute of Electrical and Electronics Engineers
Abstract
We present novel waveguide packaging for sub-millimeter and terahertz-wave devices, which is suitable for large chip-width MMICs and doesn't require any additional fabrication process. With full electromagnetic simulation, we analyze possible wave modes in a rectangular waveguide with thin E-plane slits formed for inserting large-width MMICs into the split waveguide block and show that parasitic modes can be well suppressed by lossy and high-dielectric material. For a 1.1-mm-wide test IC in the 260-320 GHz band, measured transition loss is around 1 dB with more than 60 dB inter-port isolation.
URI
http://oasis.postech.ac.kr/handle/2014.oak/37308
ISSN
1531-1309
Article Type
Article
Citation
IEEE Microwave and Wireless Components Letters, vol. 26, no. 6, page. 422 - 424, 2016-01
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송호진SONG, HO JIN
Dept of Electrical Enginrg
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