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Cited 14 time in webofscience Cited 19 time in scopus
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Packages for Terahertz Electronics

Title
Packages for Terahertz Electronics
Authors
Song
Date Issued
Jan-2017
Publisher
Institute of Electrical and Electronics Engineers
Abstract
In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and integrated circuits (ICs) and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This paper provides a broad overview of recent progress in interconnections and packaging technologies dealing with these issues for THz electronics. In particular, emerging concepts based on commercial ceramic technologies, micromachining, and 3-D printing technologies for compact and lightweight packaging in practical applications are highlighted, along with metallic split blocks with rectangular waveguides, which are still considered the most valid and reliable approach.
URI
http://oasis.postech.ac.kr/handle/2014.oak/37271
ISSN
0018-9219
Article Type
Article
Citation
Proceedings of the IEEE, vol. 105, no. 6, page. 1121 - 1138, 2017-01
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 SONG, HO JIN
Dept of Electrical Enginrg
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