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Reappraisal of grain boundary diffusion creep equations for nanocrystalline materials

Title
Reappraisal of grain boundary diffusion creep equations for nanocrystalline materials
Authors
Park, KTLee, CSShin, DHLee, YSNam, WJ
POSTECH Authors
Lee, CS
Date Issued
Jan-2006
Publisher
KOREAN INST METALS MATERIALS
Keywords
nanocrystalline materials; grain boundary diffusion creep; grain size; threshold stress; HIGH-TEMPERATURE DEFORMATION; PURE COPPER; MECHANICAL-PROPERTIES; BEHAVIOR; AL; CU; PALLADIUM; MODEL; PD
URI
http://oasis.postech.ac.kr/handle/2014.oak/24051
ISSN
1598-9623
Article Type
Article
Citation
METALS AND MATERIALS INTERNATIONAL, vol. 12, no. 2, page. 107 - 113, 2006-01
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 LEE, CHONG SOO
Graduate Institute of Ferrous Technology
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